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[SG27941] ESEC 2008XPIII Die Bonder 

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Item No
27941
Category
PKG / Die Bonder
Date
2016-08-03 10:36:03
Serial Number
206921
Vintage
2004
Wafer Size
8, 12
Configuration
MU SW Ver.: MU312.5 WH SW Ver.: WH213.6 PP SW Ver.: PP265.6 IN SW Ver.: IN609.6.2
Price
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Contact Info
SurplusGLOBAL Korea Tel : 82-31-615-6800
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