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[SG28118] ESEC 2008HS3 PLUS Die Bonder 

Item No
28118
Category
PKG / Die Bonder
Date
2016-09-20 15:23:20
Serial Number
206061
Vintage
2003
Wafer Size
8, 12
Configuration
1. PC: 102325501 SW Ver.: 3.3.9.0 SCS-22.2 2. Magazine/Stacker(TOS) to Magazine : No 3. 8 & 12" Conversion Kits : 12" * 2 Sets 4. Multi pattern function : Yes 5. DAF Thin Die
Price
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Contact Info
SurplusGLOBAL Korea Tel : 82-31-615-6800
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