- Package / Others
- 2016-07-01 17:45:01
- Serial No: 500670
Specification: DFR Lamination:
1.Applicable for Dicing-Die bonding film (2 layers) and conventional die attach film (Single layer) by changing jig. 2.Applicable for ultra thin wafers less than 50microns with Wafer Support System. 3.Laminating speed control, pressure control ensures stable lamination.
- Please login and contact seller