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[SG28116] ESEC 2008HS3 PLUS Die Bonder 

Item No
28116
Category
PKG / Die Bonder
Date
2016-09-20 15:22:20
Serial Number
207492
Vintage
2005
Wafer Size
8, 12
Configuration
1. PC: 10028468 SW Ver.: 2. Magazine/Stacker(TOS) to Magazine : No 2. 8 & 12" Conversion Kits : 12" * 1 Set 3. DAF Thin Die
Price
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Contact Info
SurplusGLOBAL Korea Tel : 82-31-615-6800
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