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[SG17834] TAKATORI DAM812MS Wafer Mounter 

Item No
Package / Others
2016-07-01 17:45:01
Serial No: 500670
Vintage: 2006
WaferSize: 8,12
Specification: DFR Lamination:
1.Applicable for Dicing-Die bonding film (2 layers) and conventional die attach film (Single layer) by changing jig. 2.Applicable for ultra thin wafers less than 50microns with Wafer Support System. 3.Laminating speed control, pressure control ensures stable lamination.
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Contact Info
SurplusGLOBAL USA Tel : 1-480-225-3619
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