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[SG27941] ESEC 2008 xP3 Die Bonder 

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Item No
27941
Category
PKG / Die Bonder
Date
2016-12-21 11:08:21
Serial Number
206921
Vintage
2004
Wafer Size
8, 12
Configuration
MU SW Ver.: MU312.5 '+CHAR(13)+'WH SW Ver.: WH213.6 '+CHAR(13)+'PP SW Ver.: PP265.6 '+CHAR(13)+'IN SW Ver.: IN609.6.2
Price
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Contact Info
SurplusGLOBAL Korea Tel : 82-31-615-6800
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