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[SG27864] ESEC 2008HS3 PLUS Die Bonder 

Item No
27864
Category
PKG / Die Bonder
Date
2016-07-04 14:02:04
Serial Number
207599
Vintage
2006
Wafer Size
8, 12
Configuration
PC: 10028468 SW Ver.: 3.3.4.0 SCS-22.1.1 Magazine/Stacker(TOS) to Magazine : Yes 8 & 12" Conversion Kits : 12" * 1 Set Multi pattern function : Yes 1st
Price
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Contact Info
SurplusGLOBAL Korea Tel : 82-31-615-6800
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