Thin Film Device Characterization

R&D Foundry

Provides various technical services from manufacturing standard thin film wafer for inspection and analysis to technical consulting
Provides the cleanroom at the level of semiconductor mass production line, 300mm dedicated process, inspection and analysis services
Suggests key quality index of device performance related quality and provides diagnosis and prediction of core technologies
Provides total solutions to connect equipment performance, recipe conditions, thin film quality and device characteristics

- Noncontact and Nondestructive Electrical Characterization of Thin Film Quality
- Mechanism Understanding of Quality Excursion
- Pre-screening and Path Finding of New Materials, New Equipment, New Processes
- Film Thickness, Warpage, Stress Evaluation
- Particle Counting
- Metal Contamination
- Plasma Damage Monitoring
- DRAM, LOGIC, VNAND, CIS Technology Roadmap
- Design of Experimentation
- Substrate, Process, Device Engineering
- Quality, Performance, Yield Improvement
- 300mm Unit or Module Process Service
- Process Equipment for In-situ Monitoring System, Chamber Characterization, RGA, EPD, FDC, MFC, Sensor, Parts, Components Evaluation
- Data Mining, Machine-learning Application Development
- R&D Local Fab for Alpha-tool Development
- One-stop Tool Evaluation utilizing Thin Film Wafer and Thin Film Device Characterization
- Demo Lab

Services

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