Stacked Structure | General Specification | Application | Remark |
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PE-TEOS Blanket - Diameter : 300mm - TEOS : 300Å ~ 40KÅ +/-3% |
CMP Consumables Test - Removal Rate or Defect test of CMP slurry, pad, conditioner, etc. |
Mass Production |
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Thermal Oxide Blanket - Diameter : 300mm - Oxide : 300Å ~ 10KÅ +/-3% |
Depo. Process Monitoring Equipment / Materials Test Carrier Wafer in Package process |
Mass Production |
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Low-k Blanket - Diameter : 300mm - Low-k : 500Å ~ 5KÅ +/-3% - k value : 2.7 ~ 3.0 |
CMP Consumables Test Depo. Process MonitoringEquipment / Materials Test |
Available in OEM Plan to mass production in 2023 |
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CVD-W Blanket - Diameter : 300mm - W : 6KÅ ~ 7KÅ +/-3% - TiN : 200Å ~ 300Å - TEOS : 1KÅ ~ 2KÅ |
CMP Consumables Test - Removal Rate or Defect test of CMP slurry, pad, conditioner, etc. |
Available in OEM Plan to mass production in 2023 |
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Cu- Electro Plate Blanket - Diameter : 300mm - EP-Cu : 10KÅ ~ 15KÅ +/-3% - Cu Seed(PVD) : 500Å ~ 2KÅ - TaN : 200Å ~ 300Å - TEOS : 1KÅ ~ 2KÅ |
CMP Consumables Test - Removal Rate or Defect test of CMP slurry, pad, conditioner, etc. |
Available in OEM Plan to mass production in 2023 |
Contact | ||
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R&D Foundry | For Any Inquiry |