Thin Film Wafer Test

R&D Foundry

Provides high quality 300mm thin film test wafer for product performance evaluation
Provides new material film test wafer for the next generation
Provides customized 300mm thin film deposition services
Provides quality data of thin film using 300mm metrology and inspection tools

General Specification	Application	Remark
PE-TEOS Blanket - Diameter : 300mm - TEOS : 300Å ~ 40KÅ +/-3%	CMP Consumables Test - Removal Rate or Defect test of CMP slurry, pad, conditioner, etc.	Mass Production
Thermal Oxide Blanket - Diameter : 300mm - Oxide : 300Å ~ 10KÅ +/-3%	Depo. Process Monitoring Equipment / Materials Test Carrier Wafer in Package process	Mass Production
Low-k Blanket - Diameter : 300mm - Low-k : 500Å ~ 5KÅ +/-3% - k value : 2.7 ~ 3.0	CMP Consumables Test Depo. Process MonitoringEquipment / Materials Test	Available in OEM Plan to mass production in 2023
CVD-W Blanket - Diameter : 300mm - W : 6KÅ ~ 7KÅ +/-3% - TiN : 200Å ~ 300Å - TEOS : 1KÅ ~ 2KÅ	CMP Consumables Test - Removal Rate or Defect test of CMP slurry, pad, conditioner, etc.	Available in OEM Plan to mass production in 2023
Cu- Electro Plate Blanket - Diameter : 300mm - EP-Cu : 10KÅ ~ 15KÅ +/-3% - Cu Seed(PVD) : 500Å ~ 2KÅ - TaN : 200Å ~ 300Å - TEOS : 1KÅ ~ 2KÅ	CMP Consumables Test - Removal Rate or Defect test of CMP slurry, pad, conditioner, etc.	Available in OEM Plan to mass production in 2023

Contact		E-mail
R&D Foundry	For Any Inquiry	email