R&D Foundry

Thin Film Test Wafer

  • 검증된 양산 장비로 300mm 웨이퍼용 증착 공정 솔루션을 제공
  • 맞춤형 박막 증착 공정 서비스를 제공
  • 양산 장비에서의 분석 service를 제공
  • 장비 성능, Recipe 조건, 박막 품질, Device 특성을 연결할 수 있는 Total solution 제공
Stacked Structure General Specification Application Remark
PE-TEOS Blanket
- Diameter : 300mm
- TEOS : 300Å ~ 40KÅ +/-3%
CMP Consumables Test
- Removal Rate or Defect test of CMP slurry, pad, conditioner, etc.
Mass Production
Thermal Oxide Blanket
- Diameter : 300mm
- Oxide : 300Å ~ 10KÅ +/-3%
Depo. Process Monitoring
Equipment / Materials Test
Carrier Wafer in Package process
Mass Production
Low-k Blanket
- Diameter : 300mm
- Low-k : 500Å ~ 5KÅ +/-3%
- k value : 2.7 ~ 3.0
CMP Consumables Test
Depo. Process MonitoringEquipment / Materials Test
Available in OEM
Plan to mass production in 2023
CVD-W Blanket
- Diameter : 300mm
- W : 6KÅ ~ 7KÅ +/-3%
- TiN : 200Å ~ 300Å
- TEOS : 1KÅ ~ 2KÅ
CMP Consumables Test
- Removal Rate or Defect test of CMP slurry, pad, conditioner, etc.
Available in OEM
Plan to mass production in 2023
Cu- Electro Plate Blanket
- Diameter : 300mm
- EP-Cu : 10KÅ ~ 15KÅ +/-3%
- Cu Seed(PVD) : 500Å ~ 2KÅ
- TaN : 200Å ~ 300Å
- TEOS : 1KÅ ~ 2KÅ
CMP Consumables Test
- Removal Rate or Defect test of CMP slurry, pad, conditioner, etc.
Available in OEM
Plan to mass production in 2023
Contact E-mail
R&D Foundry For Any Inquiry

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