Used and refurbished semiconductor equipment marketplace | SurplusGLOBAL Forbes Asia Best Under A Billion 2022 | Used and refurbished semiconductor equipment marketplace | SurplusGLOBAL

sitemap Sitemap

SITEMAP

Marketplace SurplusGLOBAL

Used and refurbished semiconductor equipment marketplace

Equipment List
  • facebook
  • linkedin
  • wechat
  • youtube
  • Instagram

Manufacturer

Disco-DFG-821-F8-Backside-Grind
Disco-DFG-821-F8-Backside-Grind
Disco-DFG-821-F8-Backside-Grind

Download All

[Remarketing] Disco DFG-821/F8 Backside Grind

Add to Watch
List
Remarketing
Event [Remarketing for GLOBALFOUNDRIES] Bid for 84 units of Semiconductor Equipment
  • Code : 2A67
  • Location : Burlington, Vermont, USA
Contact Info
SurplusGLOBAL, USA +1-408-436-5347 Email
Product Specialist
Leo Choi +82-31-728-1400 Email

Recommendations

ASM-AD830+-Die-bonding

[SG81277]
ASM AD830+ Die bonding

Packaging
KNS-ICONN

[SG66878]
KNS ICONN

Packaging
ASM-AD830-DIE-BONDER

[SG66811]
ASM AD830 DIE BONDER

Packaging
SUSSMicroTec-CB200M-Wafer-Bonder

[SG34050]
SUSSMicroTec CB200M Wafer Bonder

Packaging
SUSSMicroTec-CBC200-Wafer-Bonder

[SG34049]
SUSSMicroTec CBC200 Wafer Bonder

Packaging
Novellus-C3-Speed-XT-HDP

[SG26129]
Novellus C3 Speed XT HDP

CVD
Advantest-M6541AD-Pick-and-Place-Memory-Handler,--30~125C---No-missing

[SG71135]
Advantest M6541AD Pick and Place Memory Handler, -30~125C / No missing

ATE
Novellus-Vector-Express-PESiN-PETEOS

[SG41745]
Novellus Vector Express PESiN/PETEOS

CVD
TEL-P-12XL

[SG71770]
TEL P-12XL

ATE
Canon-FPA-3000i4-Stepper

[SG71781]
Canon FPA-3000i4 Stepper

Stepper
AMAT-Producer-GT-ACL

[SG47834]
AMAT Producer GT ACL

CVD
AMAT-P5000-Metal

[SG59592]
AMAT P5000 Metal

Etch
Nikon-NSR-S204B-DUV-Lithography

[R83976]
Nikon NSR-S204B DUV Lithography

Scanner
TEL-LITHIUS-i+-COT-DEV

[R78923]
TEL LITHIUS i+ COT/DEV

Track
AMAT-P5000-PECVD

[SG18125]
AMAT P5000 PECVD

CVD
Hitachi-RS4000-DR-SEM

[SG32068]
Hitachi RS4000 DR SEM

Metrology
AMAT-Centura-DPS2-Poly-Poly

[SG44971]
AMAT Centura DPS2 Poly Poly

Etch
Semitool-Raider-ECD310-Electroplating

[SG37946]
Semitool Raider ECD310 Electroplating

ECD
Nikon-NSR-2205EX14C-DUV-Stepper

[R84364]
Nikon NSR-2205EX14C DUV Stepper

Stepper
BMR-ICP-Etcher-ICP-Etch

[SG36639]
BMR ICP Etcher ICP Etch

Etch

Related Items

ASM-AD830-DIE-BONDER

[SG66811]
ASM AD830 DIE BONDER

Packaging
Kaijo-FB700-Wire-Bonder

[SG24382]
Kaijo FB700 Wire Bonder

Packaging
KNS-ICONN

[SG66878]
KNS ICONN

Packaging
ASM-AD830+-Die-bonding

[SG81277]
ASM AD830+ Die bonding

Packaging
Musashi-AWATRON2-AW-MV310-Mixer

[SG42304]
Musashi AWATRON2 AW-MV310 Mixer

Packaging
SUSSMicroTec-CBC200-Wafer-Bonder

[SG34049]
SUSSMicroTec CBC200 Wafer Bonder

Packaging
SUSSMicroTec-CB200M-Wafer-Bonder

[SG34050]
SUSSMicroTec CB200M Wafer Bonder

Packaging
default

[SG79787]
Sonix SONIX VISION SAT

Packaging
default

[R67483]
APT VFS-60A OVEN

Packaging
default

[B71115]Bid on Sale
Musashi FAD2500

Packaging
default

[R71684]
Hanmi Semiconductor FCB-A110 FCHIP ATTACH

Packaging
default

[B71116]Bid on Sale
HIRATA CORPORATION OF AMERICA HBAMHS-D90D

Packaging
OPTO-SYSTEM-WDS2200-LED-Chip-Sorter

[SG58717]
OPTO SYSTEM WDS2200 LED Chip Sorter

Packaging
Hyer-Photon-Systems-HPS-376KT-Laser-Scriber

[SG58715]
Hyer Photon Systems HPS-376KT Laser Scriber

Packaging
OPTO-SYSTEM-WMSS2000-LED-Chip-Probing-and-Sorter

[SG58716]
OPTO SYSTEM WMSS2000 LED Chip Probing and Sorter

Packaging
default

[R67488]
Protec Innovation DL++ UNDERFILL M/C

Packaging
default

[R71693]
MICRON PLS-1100 FCBGA FCHIP ATTACH

Packaging
default

[B71113]Bid on Sale
SONOSCAN DF2400I-THF

Packaging
default

[B71127]Bid on Sale
ULTRON UH104-12

Packaging
default

[B71117]Bid on Sale
HIRATA CORPORATION OF AMERICA HDLS-767H

Packaging
Top

Used and refurbished semiconductor equipment marketplace | SurplusGLOBAL

SurplusGLOBAL, Inc. | 56, Seochon-ro, Namsa-eup, Cheoin-gu, Yongin-si, Gyeonggi-do, 17118, Korea | Tel: +82-31-728-1400 Fax: +82-31-728-1401

Copyright (c) SurplusGLOBAL, Inc. all rights reserved

Please select the equipment category you would like to make inquires.
Front-end
Back-end
Etc
By using this site, you agree to our updated Privacy Policy and our Cookie Policy.
I Accept

Terms & Condition

View Full Article
Agree
Close

Terms & Condition

Confirm
Close

Disco DFG-821/F8 Backside Grind

Download All
Close

E-mail Inquiry

  • * E-mail

  • * Name

  • * Company

  • Mobile

  • Description


Personal Information Collection and Usage Agreement

1. Purpose of collection and use of personal information - Identification and reply of e-mail inquiry
2. Collection Items: Name, Email, Contact
3. Retention and use period: 1 year
4. You have the right to deny this consent. If you disagree, you will not be able to register.

I agree to the purpose of collecting and using personal information.

Close